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Published30/06/2025
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Today11/07/2025
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Deadline29/07/2025
Utilities
- indicates CPV codes deduced from the text of the procedure
- indicates text translated automatically in your browsing language
Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP) Text automatically translated in your browsing language Automatically translated
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH. Text automatically translated in your browsing language Automatically translated
https://steiermark.vergabeportal.at/Detail/217961
https://steiermark.vergabeportal.at/Detail/217961
38000000 - Laboratory, optical and precision equipments (excl. glasses)
31700000 - Electronic, electromechanical and electrotechnical supplies CVP code deduced from the text of the procedure AI-generated
31710000 - Electronic equipment CVP code deduced from the text of the procedure AI-generated
Type: quality
Description: Delivery and installation time
Weight (percentage, exact): 5
Criterion:
Type: quality
Description: Commitment to target requirements
Weight (percentage, exact): 40
Criterion:
Type: quality
Description: Warranty of functionality period
Weight (percentage, exact): 5
Criterion:
Type: price
Description: Price of the HiPIMS & ICP modules equipment (delivery, installation, commissioning and training)
Weight (percentage, exact): 50
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