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Published13/08/2026
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Deadline14/09/2026
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Today15/09/2026
Utilities
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Etching system for deep silicon etching for MEMS
The Ruhr-Universität Bochum intends to procure a DRIE etching system, which will be used in the Microelectronics Bochum research laboratory for wafer substrates up to 200 mm in diameter. It will be used in the field of silicon-based micro-electromechanical systems (MEMS) for deep anisotropic silicon etching based on a cyclic etching process (DRIE, "BOSCH process") and will also serve to research new etching concepts that use less climate-damaging etching gases.
https://www.evergabe.nrw.de/VMPSatellite/notice/CXPNYH7D2XQ
https://www.evergabe.nrw.de/VMPSatellite/notice/CXPNYH7D2XQ
38000000 - Laboratory, optical and precision equipments (excl. glasses)
22000000 - Printed matter and related products
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