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Published04/11/2024
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Deadline29/11/2024
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Awarded11/12/2024
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Today06/06/2026
Utilities
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Supply of wafer cutting equipment up to 200 mm in size for the CEA LETI Institute
This consultation concerns the supply of wafer cutting equipment up to 200 mm in size.
https://www.marches-publics.gouv.fr/entreprise
https://www.marches-publics.gouv.fr/entreprise
Type: price
Description: Le prix n'est pas le seul critère d'attribution et tous les critères sont mentionnés dans le projet de marché.
Weight (percentage, exact):
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