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Published14/04/2025
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Today18/04/2025
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Deadline12/05/2025
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Opening of tenders12/05/2025
Utilities
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Note: Not all information for this procedure were successfully computed. Please consult linked documents for more details.
As part of this tender, plants for a classic microstructuring process chain for the cleanroom are procured. Part of the process chain is the deposition and structuring of metallic, dielectric and semiconductor thin films on substrates with a maximum diameter of 150 mm. The tender includes a combination device with magnetron sputtering sources and an ion beam etching (IBE) system. The tender only covers the specified facilities, the media and peripherals required for this are provided separately by DLR. Further information can be found in the attached specifications (contract documents). Text automatically translated in your browsing language Automatically translated
https://www.subreport.de/E57787747
https://www.subreport.de/E26547481
Type: price
Description: 50 %
Weight (percentage, exact):
Criterion:
Type: quality
Description: Zusammengesetzt aus: Qualität 30% Service 20%
Weight (percentage, exact):
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