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Published01/07/2026
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Deadline31/07/2026
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Today14/08/2026
Utilities
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Supply of deposition equipment dedicated to the metal filling of low temperature vias
For its research activities, which aim to develop 10nm FDSOI technologies and beyond, CEA-Leti wishes to acquire equipment dedicated to the metal filling of low-temperature vias, for memory applications, for its white room. The equipment will be capable of using 300mm wafers and is intended for the deposition of high-conformity fine tungsten film in vias with a high form factor. The contract envisaged includes one option with compulsory encryption and four options with optional encryption: - Option with mandatory enumeration: . Option 3 (optional service): Maintenance training level 1 – Options with optional enumeration: . Option 1 (optional supply): Heat exchangers / chillers . Option 2 (optional supply): . Power Supply Transformer Option 4 (optional service): Advanced Maintenance Training . Option 5 (optional service): One year warranty extension
https://www.marchespublics.gouv.fr
https://www.marchespublics.gouv.fr
Type: price
Description: Le prix n'est pas le seul critère d'attribution et tous les critères sont énoncés uniquement dans les documents du marché.
Weight (percentage, exact):
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