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Published14/01/2025
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Deadline17/02/2025
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Opening of tenders17/02/2025
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Today28/03/2025
Utilities
- indicates CPV codes deduced from the text of the procedure
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Acquisition of a multi-substrate laser engraver Text automatically translated in your browsing language Automatically translated
The subject of the contract is the acquisition of a multi-substrate laser engraver (machining, drilling, cutting) and associated software for complex realizations of PCBs, components, RF circuits and microwaves on multi-substrates to meet the current needs of rapid manufacturing of electronic prototypes that can integrate extreme miniaturization factors at the micrometric scale. Text automatically translated in your browsing language Automatically translated
https://www.marches-publics.gouv.fr/?page=Entreprise.EntrepriseAdvancedSearch&AllCons&id=2671439&orgAcronyme=f2h
https://www.marches-publics.gouv.fr/?page=Entreprise.EntrepriseAdvancedSearch&AllCons&id=2671439&orgAcronyme=f2h
31712100 - Microelectronic machinery and apparatus
38000000 - Laboratory, optical and precision equipments (excl. glasses) CVP code deduced from the text of the procedure AI-generated
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