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Acquisition of atomic layer deposition (ALD) equipment for aluminium oxide, titanium oxide and hafnium oxide - EU tenders
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Acquisition of atomic layer deposition (ALD) equipment for aluminium oxide, titanium oxide and hafnium oxide Text automatically translated in your browsing language Automatically translated

  • Published
    02/06/2025
  • Deadline
    16/06/2025
  • Opening of tenders
    18/06/2025
  • Today
    11/07/2025
Status
Submission closed
Type of contract
Supplies
Subject for Renewal
No
Buyer
Rectorado de la Universitat PolitĆØcnica de ValĆØncia
Place of performance
NUTS code: Multiple place of performance
Location of buyer
NUTS code: ES523 Valencia / ValĆØncia
Business sector (Main CPV)
31712100 Microelectronic machinery and apparatus
Total estimated contract value (excluding VAT)
450,000.00 EUR
Total final contract value (excluding VAT)
Not available
Tender reference number
MY25/IUTNA/S/20
Description

The current capacity to deposit dielectric materials at the NTC institute at micro/nanometric scale and wafer level is limited to chemical vapour deposition (CVD) techniques. Plasma-enhanced chemical vapour tank equipment is available which offers amorphous dielectric thin films. The ALD process consists of the growth of a thin film by consecutive atomic layers. The fact of having an ALD equipment that in addition to increasing the manufacturing capacity, will offer uniformity and conformity of the film on any scale and would have a clear impact on the quality of the research carried out as well as on the capacities offered by the NTC Institute would be very high. ALD is the most advanced thin film coating technique due to the precise film thickness control (nm) it offers. The films produced by this technique are dense, pore-free and flawless, and the conditions under which the process is carried out, 1-10 hPa 200-400oC, are soft enough to be used with sensitive substrates. This type of process is also essential when working with external customers and supplying quality controls and technical specifications of the manufactured devices. As the semiconductor industry continues to evolve, the ever-thinning size of devices makes it especially important to find or develop more advanced thin film growth techniques that require low temperature, high film thickness accuracy, and excellent conformability in three-dimensional (3D) structures. Therefore, this center lacks the necessary equipment to ensure quality and compliance with specifications at the nanometric level during the manufacturing process. To fill these gaps, the purchase of a multi-oxide atomic layer deposition equipment is requested. Text automatically translated in your browsing language Automatically translated

Submission Method
Electronic via:
https://contrataciondelestado.es/wps/poc?uri=deeplink:detalle_licitacion&idEvl=IRysbXv42tsaF6cS8TCh%2FA%3D%3D
Tenders may be submitted
Electronic submission: required
https://contrataciondelestado.es/wps/poc?uri=deeplink:detalle_licitacion&idEvl=IRysbXv42tsaF6cS8TCh%2FA%3D%3D
Information about a public contract, a framework agreement or a dynamic purchasing system (DPS)
Not available
Conditions for opening tenders (date)
18/06/2025 09:00
Award method
Criterion:
Type: quality
Description: Caracterƭsticas tƩcnicas adicionales.
Weight (percentage, exact): 40
Criterion:
Type: price
Description: Oferta económica.
Weight (percentage, exact): 60
Estimated value
450,000.00 EUR
Final contracted value
Not available
Award of contract
Not available
Prior information
Contract
Award
Footnote - legal notice

This content published on this page is meant purely as an additional service and has no legal effect. The Union's institutions do not assume any liability for its contents. The official versions of the relevant tendering notices are those published in the Supplement of Official Journal of the European Union and available in TED. Those official texts are directly accessible through the links embedded in this page. For more information please see Public Procurement Explainability and Liability notice.